OpenLight, the world leader in custom PASIC chip design and manufacturing, and Tower Semiconductor (NASDAQ/TASE: TSEM), the ...
NVIDIA's chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of ...
Advancing 3D Sensing, Optical Interconnects, AI, and Quantum Computing GOLETA, CA / ACCESS Newswire / March 10, 2025 /SPIE Defense + Commercial Sensing 2025 - Aeluma, Inc. (OTCQB:ALMU), a ...
Boise State University has qualified a new Aixtron 2D Close Coupled Showerhead MOCVD system for multi-wafer growth of wide ...
Innovation paves the way for a high-volume, silicon photonics 400G/lane platform to meet next-generation 3.2T optical communication architectures for datacom and AI applications. The integrated ...
Siltronic (SLTCY) faces profitability challenges due to cyclical market dynamics and lack of pricing power despite growth.
SEALSQ already manufactures its semiconductors in Singapore, Taiwan, and Thailand. By further expanding its footprint in Singapore would enable the Company to strengthen its Asian semiconductor supply ...
Infineon Technologies AG offers the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. The new OptiMOS TDM2454xx quad-phase power ...
tom's Hardware on MSN2d
ASML teams up with Imec for sub-2nm process technologies with High-NA EUV chipmaking toolsASML to install its High-NA EUV lithography tools in Imec's pilot production line to give research and development personnel ...
Quantum Computing: Leveraging 12-inch wafer technology to merge high performance materials with scalable manufacturing platforms. Next-Generation Applications: Transforming future advanced-node ...
Wafer-level testing Teradyne says that the deal will enable it to deliver scalable PIC test solutions at a time when PIC production is set to boom - largely as a result of hefty recent investment in ...
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